Samsung has unveiled the “Memory Module Box” that can accommodate up to 2TB of high-speed HBM3E memory per box. With a total bandwidth of 60 GBps and a low latency of 596 nanoseconds, this box is ideal for memory-intensive tasks such as AI, in-memory databases, and data analysis.
Samsung’s memory box connects to the main processing unit of servers through the new Compute Express Link (CXL) bus, a technology that Intel and a group of IT companies have been pushing for. The CXL bus is designed to compete with NVIDIA’s NVLink and AMD’s CCIX.
Officially named the CXL Memory Module – Box (CMM-B), Samsung has partnered with Supermicro to release 4U rack servers that utilize the CMM-B.
Source: Samsung, TechRadar
TLDR: Samsung introduces the Memory Module Box with high-speed HBM3E memory, low latency, and 60 GBps bandwidth, suitable for memory-intensive tasks like AI and data analysis. The box connects to servers via the new Compute Express Link (CXL) bus, offering competition to NVIDIA’s NVLink and AMD’s CCIX.
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