Jensen Huang, the CEO of NVIDIA, admitted in an interview with Reuters that the Blackwell chip had design issues, as rumored previously, leading to a delay in delivery. Huang revealed that the design flaw in the chip resulted in lower production yield rates. This problem was solely on NVIDIA’s end, but the company collaborated with TSMC to successfully address the issue. Currently, TSMC is able to ramp up production of Blackwell to full capacity, and deliveries are set to begin in the fourth quarter of this year.
Huang explained that Blackwell is highly complex, requiring 7 sub-chips to work together and simultaneous chip production processes. The size of the chip is significantly larger than its predecessor models.
Source: Reuters
TLDR: Jensen Huang acknowledged design flaws in the Blackwell chip, resulting in production delays, but collaboration with TSMC has resolved the issue, with deliveries starting in Q4.
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