MediaTek has unveiled a trio of mid-range SoC chips that follow the Dimensity 9400 and 8400 models previously released.
The Dimensity 7400 (for general smartphones) and Dimensity 7400X (for foldable phones) feature an 8-core CPU with a configuration of Cortex-A78 x4 + Cortex-A55 x4, Mali-G615 MC2 GPU, manufactured with TSMC’s 4nm process. These chips boast energy savings during gaming of 14-36% compared to similar competitors, utilizing an improved 6.0 version NPU with a 15% performance boost from the previous generation. The Imagiq 950 image processing chip supports Google Ultra HDR, Wi-Fi 6E, and 5G modem with a 3CC carrier aggregation (3CC-CA) in the R16 spec.
On the other hand, the Dimensity 6400 features an 8-core CPU with a configuration of Cortex-A76 x2 + Cortex-A55 x6, Mali-G57 MC2 GPU, manufactured with TSMC’s 6nm process, and a 5G modem with a 2CC carrier aggregation (2CC-CA) in the R16 spec.
Smartphones powered by Dimensity 7400/7400X are set to be launched in the first quarter of 2025, while smartphones utilizing Dimensity 6400 are already available for purchase.
Source: MediaTek
TLDR: MediaTek introduces mid-range Dimensity 7400 and 7400X SoC chips with energy-efficient gaming performance and improved NPU, alongside the Dimensity 6400 for smartphones, currently in the market.
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