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Initiating Production of 12-Layer Stacked HBM Chips with Up to 36GB Capacity: SK Hynix Announces Milestone Innovation

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3 months ago
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SK Hynix has announced the commencement of production of their flagship high bandwidth memory (HBM3E) stacked 12-layer chip, in line with the company’s previously disclosed plans. The HBM3E stacked 12-layer...

Exploration: OpenAI Engages in Indepth Research to Pave the Way for Autonomous AI Chip Development, Enabling ChatGPT Integration

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1 year ago
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Reuters reports that OpenAI, the developer of ChatGPT, is studying the possibility of creating its own AI chip. This includes considering the option of acquiring a company specializing in this...