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Introducing Azure’s HBv5 Bandwidth-Rich Machine with Astonishing 6.9 Tb/s High Memory, Powered by Customized AMD Epyc Processor.

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1 month ago
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Microsoft Azure has unveiled the new Azure HBv5 VM series, boasting the use of high bandwidth memory (HBM) with a data transfer rate of up to 6.9 TB/s, surpassing many...

Initiating Production of 12-Layer Stacked HBM Chips with Up to 36GB Capacity: SK Hynix Announces Milestone Innovation

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3 months ago
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SK Hynix has announced the commencement of production of their flagship high bandwidth memory (HBM3E) stacked 12-layer chip, in line with the company’s previously disclosed plans. The HBM3E stacked 12-layer...

Samsung CEO unveils booming packaging chip business, anticipates revenue to surpass $100 million this year.

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9 months ago
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Kye-Hyun Kyung, CEO of Samsung, has disclosed that the packaging chip business is expected to generate revenue of over $100 million this year. Samsung established this packaging chip business separately...