Reserving 50% of TSMC’s CoWoS Chip Packaging Factory, NVIDIA Urges SK Hynix to Expedite HBM4 Memory Delivery by Half a Year.
CNA, the Taiwanese news agency, has reported that NVIDIA has secured 50% of TSMC’s CoWoS (Chip on Wafer on Substrate) chip packaging capacity for the year 2025, despite TSMC ramping...