SK Hynix’s CEO, Kwak Noh-jung, disclosed in a press release at the headquarters that the demand for High Bandwidth Memory (HBM) chips is currently at an all-time high. The products manufactured by the company for this year have been fully ordered, and the production for sale in 2025 is almost at capacity as well.
Furthermore, SK Hynix stated that Artificial Intelligence (AI) is a significant factor driving the increased demand for HBM. Factors such as increased speed, higher bandwidth, and lower energy consumption have led to a surge in orders, with NVIDIA being a key customer.
In terms of technology, the company will begin production of HBM3E test products, featuring 12 stacked memory layers, this month. Mass production is expected to commence in the third quarter of this year.
Kim Ju-seon, the president of SK Hynix responsible for the foundational structure of AI, mentioned that the volume of data generated in the AI era is expected to significantly increase. It is estimated to reach 660ZB by 2030, up from 15ZB in 2014 (1ZB – Zettabyte is equivalent to one billion TB).
Currently, SK Hynix holds approximately 50% of the HBM market share, followed by Samsung at 47% and Micron at 3%.
Source: The Korea Herald
**TLDR: SK Hynix’s CEO reveals surging demand for HBM chips, driven by AI advancements. The company gears up for mass production of HBM3E with 12 memory layers and predicts data volume to soar to 660ZB by 2030. SK Hynix leads the HBM market share at 50%.**
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