SK Hynix, a major RAM manufacturer, has announced a collaboration with TSMC to develop the next-generation HBM4 RAM manufacturing process, aiming to mass-produce it in 2026. Previously, SK Hynix has been using its own technology to produce HBM RAM consistently.
This collaboration involves multiple components in HBM RAM, with several DRAM chips stacked on top of each other to achieve high bandwidth. These are then connected to a base die at the bottom to manage RAM operations and interface with external chips such as graphics chips. In this announcement, SK Hynix will leverage TSMC’s base die technology to enhance RAM packaging.
HBM RAM has become a crucial component in the AI industry in recent years and is a bottleneck in delivering high-performance AI training servers.
Source: SK Hynix
TLDR: SK Hynix partners with TSMC to develop HBM4 RAM, utilizing TSMC’s base die technology for improved RAM packaging and addressing AI industry needs.
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