Home ยป Disruption: NVIDIA Blackwell Encounters Thermal Challenges in High-Density Server Environments

Disruption: NVIDIA Blackwell Encounters Thermal Challenges in High-Density Server Environments

The tech news website, The Information, reports unofficially that the latest NVIDIA Blackwell GPU, eagerly awaited worldwide, is facing high heat issues when used in servers that require multiple GPUs (72 units) packed closely together. This has forced NVIDIA to redesign the server rack layout multiple times, resulting in delays in delivering the Blackwell GPU.

This heat issue is a significant concern for major tech giants requiring high-density servers for use in large data centers, such as Google, Microsoft, Meta. Reports suggest that NVIDIA is collaborating with these partners and various server manufacturers to address the heat problems.

Previously, Jensen Huang acknowledged production issues with the Blackwell chip, but with assistance from TSMC, the issues have been resolved, albeit causing a delay in production once.

Source: The Information, Tom’s Hardware

TLDR: The latest NVIDIA Blackwell GPU is facing heat issues in high-density server setups, causing delays in production and delivery. Collaboration with partners and manufacturers is underway to address the problem.

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The Blackwell chip faces real-world production challenges; TSMC steps in to provide solutions.