Infineon, a German chip company, has opened its latest Kulim plant focusing on energy and automotive chip production. This facility is the second module with plans to immediately construct a third module. Once completed, this plant will become the world’s largest 200mm wafer chip factory.
Using wide-bandgap (WBG) technology, this plant will produce chips utilizing Silicon Carbide (SiC) and Gallium Nitride (GaN) as primary materials. This expansion relies on advance orders from Infineon’s customers, totaling 5 billion euros, paid upfront in billions. Production is expected to be fully operational by 2030, with the second phase of the facility taking an additional 5 years to complete.
The semiconductor industry primarily utilizes two main wafer sizes, the small 200mm, suitable for low-complexity but high-volume chips, and the 300mm for high-complexity, cutting-edge technology production.
TLDR: Infineon’s new Kulim plant focuses on energy and automotive chip production, utilizing WBG technology with plans to become the world’s largest 200mm wafer chip factory.
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