Intel announced at the Intel Foundry Direct Connect 2024 event that they have plans to start producing chips with 1nm or 10A technology by the end of 2027. Intel’s manufacturing roadmap also reveals that they are currently producing chips in the EUV group, including Intel 4, Intel 3, Intel 20A, and Intel 18A, which will gradually increase until they become the majority of production (measured in wafers per week) by 2026.
In addition to advancements in chip manufacturing technology, Intel is also rapidly ramping up its chip packaging capabilities in 2024. Technologies such as Foveros, EMIB, SIP, and HBI (hybrid bond interconnect) are crucial for producing highly efficient new chip models. The term semiconductor manufacturing technology in recent years has often failed to reflect the actual circuit size on the chip, despite claims of at least a 10-15% efficiency improvement compared to previous technologies.
TLDR: Intel is gearing up to produce 1nm chips by 2027, while also expanding its chip packaging technologies like Foveros and EMIB for more efficient chip production.
Leave a Comment