AMD has announced the official launch of their artificial intelligence accelerator chips for data centers, the Instinct MI325X, after its mid-year debut. This chipset is said to set a new standard in AI model processing with the CDNA 3 architecture, featuring a high-bandwidth HBM3E memory of 256GB that supports data transfers of up to 6.0TB/s. Compared to NVIDIA’s H200, AMD claims the MI325X has over 1.8 times greater capacity and 1.3 times more bandwidth.
The Instinct MI325X chips are currently in production and are expected to be delivered according to plan in the fourth quarter of 2024 through partners such as Dell Technologies, Eviden, Gigabyte, Hewlett Packard Enterprise, Lenovo, Supermicro, and others in the first quarter of 2025.
Additionally, AMD has revealed the roadmap for their next-generation chipset, the Instinct MI350, based on the CDNA 4 architecture with 3-nanometer technology. This new chipset aims to improve processing performance by 35 times compared to the CDNA 3 chips. It is projected to be available for sale in the latter half of 2025, followed by the MI400 in 2026 utilizing the next-generation CDNA architecture.
Source: AMD Press Release
TLDR: AMD unveils the Instinct MI325X AI accelerator chip for data centers with advanced features and high processing capabilities, set to be delivered through various partners in early 2025. Plans for the next-generation MI350 and MI400 chips have also been announced, showcasing significant performance enhancements in AI model processing.
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