Kye-Hyun Kyung, CEO of Samsung, has disclosed that the packaging chip business is expected to generate revenue of over $100 million this year. Samsung established this packaging chip business separately last year and anticipates it will contribute to the overall profitability of Samsung.
Currently, the DRAM chip is the standout semiconductor business of Samsung, holding a global market share of 45%. This necessitates Samsung to maintain its strength by producing high-bandwidth memory (HBM) chips that support AI tasks. The latest version can stack memory chips up to 12 layers, known as HBM3E, with plans for a new version, HBM4, with even higher bandwidth in 2025.
Source: Reuters
TLDR: Samsung’s packaging chip business is set to surpass $100 million in revenue this year, while their DRAM chip segment remains dominant, with plans for new and improved HBM chips in the future.
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