MediaTek has proudly announced the successful production of their Dimensity chips using TSMC’s advanced 3nm manufacturing process. This breakthrough achievement means that MediaTek will begin mass production of these chips in the coming year.
While details about the new Dimensity chips are still scarce and will likely be revealed at a later date, it is worth mentioning that these chips are expected to be put into actual use during the second half of 2024.
TSMC’s 3nm manufacturing process allows for a 60% increase in transistor density compared to the 5nm process, resulting in improved performance. Additionally, it brings about a 32% reduction in power consumption for the same level of functionality.
TSMC initiated the production of 3nm chips in late 2022 and anticipates their initial customers to include Apple, who will likely utilize them for their A17 Bionic (iPhone 15) and M3 chips.
TLDR: MediaTek has successfully produced Dimensity chips using TSMC’s 3nm manufacturing process. Details about the new chips are forthcoming, but they are expected to be used in the latter half of 2024. TSMC’s 3nm process offers higher transistor density and improved energy efficiency. Apple is expected to be one of the first customers for these chips.
Leave a Comment